Opened in 2006 and located in the basement level, our Cleanroom Facility offers a pristine and controlled research environment.

The space

We have a variety of cleanrooms available including:

  • 330 m2 of ISO Class 6 (1,000) area
  • 115 m2 of ISO Class 7 (10,000) facility
  • 50m2 Level 2 Biohazard space

Our Class 6 cleanroom is a  modified ‘ballroom’ layout and is broken into eight separate bays with a central corridor and a service chase around the perimeter.

We have optimized functionality and maximized space by running all utilities either under the floor or through portholes in the end walls.

The NINT Cleanroom(s) are tightly monitored and controlled environments suitable for a wide range of manufacturing and research projects

Additional 325 m2 of Space for future development as cleanroom(s) or lab space.

Also available an additional 100m2of Level 2 biohazard Space for future development


An underfloor network provides cleanroom users access to LN2, Compressed Air and house vacuum.

The Cleanroom also provides users access to a state of the art Electronic Grade Di water system. Our RO plant is capable of producing 9.1gpm of Di water which is supplied to the cleanroom at a rate of 60gpm at 105psi. All wet processing equipment in the cleanroom uses this Di water to ensure client samples only come in contact with UPW.

Due to the nature of the research done in the cleanroom we are required to house several Toxic and Flammable Gases, so we have designed and implemented an intricate storage, delivery, monitoring and testing system to ensure clients safety.

Originally designed as a semiconductor facility, our capabilities have continued to evolve in order to better complement the current toolset at the University of Alberta’s Nanofab. This allows users of both facilities to benefit from more diversified resources including:

  • Deposition Tools
  • Dry Etch
  • Wet Etch
  • Lithography
  • Metrology
  • Assembly

Deposition Tools

Oxford Industries FlexAL 
Atomic Layer Deposition (ALD)


  • Located in the Class 1000 cleanroom
  • Up to 4 liquid or gas precursors
  • Conformal growth is self-limited and based on surface reactions.
  • Current capabilities include Al2O3, TiO2, TIN and Hafnium

Johnsen E-Beam Evaporation System


  • User friendly software
  • Samples from pieces up to 8 – 4” wafers
  • 6 source pockets for deposition material
  • Load lock enables rapid pump down, capable of pressures from mid to low 7’s in 15 minutes
  • Programmable sweep patterns
  • Programmable deposition rates and thickness
  • RGA
  • Deposition materials dielectrics and metals

Tystar Mini – Titan 4600 LPCVD Reactor


  • Modified for SNW and CNT manufacturing
  • Can process up to 50 4” or 6” wafers
  • 2 empty tubes for future expansion
  • Current Processes
    • Tube – 2 Atmospheric Chemical Vapor Deposition (APCVD)
    • Carbon Nanotubes, , Graphene on catalyst, Wet oxidation and anneal
    • Tube – 3 Low Presurre Chemical Vapor Deposition (LPCVD)
    • SiNW, GeNW, Si/Ge Nanowires, Poly silicon, amorphous Silican and Poly-germaniam

Dry Etch

Oxford Industries Plasmalab 100
Chlorine Etcher


  • Conductor, Semiconductor, Insulator and Polymer etches
  • Metal and dielectric etch capabilities
  • Heated/cooled chuck
  • Canned recipes and support available through vendor
  • Configured for up to 12 gases , 8 Toxic and 4 non-toxic, to allow for maximum process flexibility

Tegal 901e Plasma Etcher

  • Resist strip
  • Descum

Wet Etch


  • 8’ Poly Pro ReynoldsTech Wet Deck
  • 6’ Weslan Poly Pro Acid Wet Deck
  • 4’ Bold Technologies Poly Pro HF Wet deck
  • Semitool 4” Spin,rinse, Dryer (SRD)
  • Idonus VPE150
•  HF vapour Phase etcher
•  Electrostatic chuck 
•  Small pieces up to 6” substrate



  • All forms of Nanoimprint
    • Thermoplastic
    • Photo curable
    • Simultaneous Thermal and UV
    • Embossing
  • Sub 10nm resolution
  • Sub 1 um overlay alignment


Quintel 4000 contact Aligner

  • Can handle partial, 4” or 6”  substrates
  • Pressure and vacuum contact exposure
  • Manual, auto and first expose capabilities
  • Constant  intensity meter


Y.E.S – H.M.D.S. Vapour Prime Oven

  • Dehydration bake
  • Application of adhesion promoter
  • General access

Site Services XP – Combo

  • Semi automatic coat/bake/develop
  • Capable of processing small pieces up to and including 6″ wafers
  • General access


Bidtech SP -100

  • Manual spinner
  • General access


Filmetrics F-50

  • Thickness mapping system
  • Used to measure thickness of dielectrics, semiconductors and thin metal films
  • Films must be optically
 smooth and between 100Å and 450 microns
  • Up to 8” diameter

KLA-Tencor P-10

  • Surface Profilometer – ( Step Height Measurement Tool)
  • Precise measurements of profiles of roughness less then 10Å and features below 100Å
  • Low noise characteristics allow a repeatability of 8Å maximum in the 6.5um range

Ultracision, Inc 680E

  • Semi-automatic Probe Station
  • 2 – left hand and 2 – right hand  positioners for device testing
  • Keithly 2602 Dual Channel System Source Meter

2 Olympus optical inspection microscopes

  • Image capture system
  • BF and DF
  • Nomarski Interference Contrast (NIC ) filter to enhance contrast

Lucas 4 – Point Probe


Model K&S 4523 Wedge Bonder

  • 30/45 degree wire feed angle
  • Ultrasonic Generator
  • 2 channel independent Bonding Parameters
  • Semi – auto and manual Z Bonding modes
  • Built in digital temperature controller
  • Heated chuck/sample holder
  • Al and Au wire

7200CR-79 Epoxy Die Bonder

  • Height adjustment
  • Epoxy dispense tool
  • Die pickup and placement tool with die rotation capability

LSD – 100 Scribe and Break Tool

  • Roller style breaker
  • Motorized Rotation Control
  • 4” wafer capacity
  • Colour camera
  • Machine control software
  • Windows XP